Glass Laser Cutting/Splitting Integrated Machine
We are deeply versed in high precision cutting of glass, ceramics, semiconductor, diamond, and other materials. We provide high-efficiency, high-precision laser solutions for brittle machining industries. Our high performance laser equipment is extensively utilized in cutting, drilling and marking various brittle materials, including optical glass, ultra clear glass, soda-lime glass, sapphire and cover glass.
Equipment Advantages
- 🚀 1. Cutting edge Picosecond processing technology for high speed cutting.
- 🎯 2. Optical system equipped with imported lenses for high quality transmission.
- 📏 3. High dimensional accuracy, minimal chipping and no taper.
- 🔄 4. Optional automatic input/output system (dual platforms).
Key Configurations
- Ultrafast Laser Technology: Picosecond/Femtosecond laser that achieves "cold" processing, leaving virtually no HAZ (Heat Affected Zone).
- Chipping-Free Cutting: Unique beam shaping technique that leaves a smooth cutting without fissure. Chipping no greater than 10 micrometer.
- Intelligent Cutting Path Optimization: Professional optimization to significantly increase production efficiency.
- Customized Service: Personalized service for ultra large glass cutting, replacing traditional techniques.
Manufacturing Excellence
Operating since 2012, our facilities include 80,000 square meters of production factories. As a national high-tech enterprise, we hold 150 national patents and have participated in the formulation of industry standards. Our products are sold in more than 100 countries, providing high-quality equipment to industrial customers worldwide.
Service Commitment
We strictly adhere to the ISO9001: 2015 international quality management system standard. A professional service team responds quickly 24 hours a day to ensure smooth production for every customer.
Frequently Asked Questions
What materials can this laser machine process?
The machine is specifically designed for high-precision cutting and drilling of brittle materials, including optical glass, sapphire, cover glass, ceramics, and semiconductors.
What is the advantage of Picosecond technology over traditional methods?
It uses "cold" processing, which results in virtually no Heat Affected Zone (HAZ), significantly reduced edge chipping (less than 10μm), and much higher processing speeds.
What kind of after-sales support do you provide?
We offer a one-year warranty, remote video guidance, and 24-hour technical support. We also ensure a stable supply of genuine parts and consumables.
Is the machine certified for international markets?
Yes, our equipment is CE certified and manufactured under the ISO9001:2015 quality management system.
What is the typical delivery time for a new order?
The standard delivery date is approximately 35 days after the receipt of payment, depending on customization requirements.
Can the working area be customized?
Yes, while the standard area is 600*800mm, we provide personalized service for ultra-large working areas to replace traditional mechanical techniques.